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datashee t product structure silicon monolithic integrated circuit this product is not designed prot ection against radioactive rays. 1/23 tsz02201-0333aac00090-1-2 18.mar.2013 rev.003 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 14 ? 001 7.5v to 15v, 3a integrated mosfet 1ch synchronous buck dc/dc converter bd95831muv description bd95831muv is a 1ch synchronous buck converter that can generate output voltage (0.8 v to 5.5v) at the input voltage range (7.5v to 15v). space-saving and high efficient switching regulator can be achieved due to built-in n-mosfet power transistors. the ic also incorporates h 3 reg tm technology, a rohm proprietary constant on time contro l mode which facilitates ultra-high transient response against changes in load without external compensation components. fixed soft start function, power good function, and short circuit / over voltage protection with timer latch functions are incorporated. the bd95831muv is designed for power supplies for digital av equipment. applications ? lcd tvs ? set top boxes (stb) ? dvd/blu-ray players/recorders ? broadband network and communication interface ? amusement, other. typical application features ? input voltage range: 7.5v to 15.0v ? reference voltage: 0.8v 1.5% ? output voltage range: 0.8v to 5.5v ? output current: 3.0a (max.) ? switching frequency: 500khz to 800khz depend on input-output condition ? built-in power mos fet high-side nch fet on resistance: 85m (typ.) low-side nch fet on resistance: 55m (typ.) ? fast transient responses due to h 3 reg control ? over current protection (ocp) C cycle-by-cycle ? thermal shut down (tsd) ? under-voltage lock-out (uvlo) ? short circuit protection (scp) ? over voltage protection (ovp) ? fixed soft start (1msec ; typ) ? power good function package w(typ.) x d(typ.) x h(max.) ? vqfn016v3030 3.0mm x 3.0mm x 1.0mm pin configuration (top view) figure 1. typical application circuit figure 2. pin configuration 1 2 3 4 5 6 7 8 12 11 10 9 16 15 14 13 vinvin pgnd bootsw sw gnd test vin pgnd sw vreg fb vout pgood en 1 234 5 6 7 8 9 10 11 12 1314 15 16 vin vin pgnd pgnd sw sw sw boot en pgood vout fb gnd vreg vin thermal pad vout vin gnd gnd en pgood gnd test downloaded from: http:///
datasheet d a t a s h e e t 2/23 bd95831muv tsz02201-0333aac00090-1-2 18.mar.2013 rev.003 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 block diagram pin description no. symbol description 1, 2, 16 vin input voltage supply pin. the ic determines the duty cycles internally based on the input voltage. ther efore, variations of vin pin can lead to unstable operatio n. this pin also acts as the input voltage to the internal switching regulator output block, and is sensit ive to the impedance of the power supply. connect over 10 ? f ceramic capacitors for the decoupling capacitors to pgnd as near as these pins. 3, 4 pgnd power ground pin connected to the source of the low side fet. 5, 6, 7 sw switch node connection between high side fet source and low side fet drain. connect 0.01 f capacitor between boot and sw. this pin is also connected to inductor (l). 8 boot high side fet gate driver power supply pin. connect 0.01 f capacitor between boot and sw. boot voltage swings from vreg to (vin + vreg) during normal switching operation. 9 en enable input pin. when the input voltage of the en pin reaches at least 2.2v, the switching regulator becomes active. at the voltage less than 0.3 v, the ic becomes standby mode. 10 pgood open-drain power good output pin. due to the open-drain output, a 100k ? pull-up resistor should be connected between this pin and vreg or other power supply. in the case of no use, this pin is opened or shortened to ground. figure 3. block diagram downloaded from: http:///
datasheet d a t a s h e e t 3/23 bd95831muv tsz02201-0333aac00090-1-2 18.mar.2013 rev.003 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 pin description (continued) no. symbol description 11 vout output voltage sense pin. connect to output voltage directly. ontime is determined by monitoring the output voltage. 12 fb output voltage feedback pin. fb is compared with ref in the ic. please set the output voltage in the feedback resistances of less than total 50k ? . (refer to page 15) 13 gnd sense ground pin for all internal analog and digital power supplies. 14 vreg power supply output inside ic. when at least 2.2v is supplied to the en pin, the vreg is active. this pin supplies 5.0v at up to 10ma. insert a 0.022 f capacitor between this pin and ground pin. 15 test test pin. connect to ground. thermal pad - exposed thermal pad. connect to ground. downloaded from: http:///
datasheet d a t a s h e e t 4/23 bd95831muv tsz02201-0333aac00090-1-2 18.mar.2013 rev.003 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 absolute maximum ratings (ta=25 ) parameter symbol limit unit comment input voltage vin 15.2 * 1 v boot voltage boot 21.5 * 1 v boot-sw voltage boot-sw 7 * 1 v input voltage vout 7 * 1 v sw voltage sw 15.2 * 1 v output feedback voltage fb vreg v vreg voltage vreg 7 * 1 v en input voltage en 15.2 * 1 v pgood voltage pgood 7 * 1 v power dissipation 1 pd1 0.27 w ta R 25c (ic only), power dissipated at 2.2mw / c. power dissipation 2 pd2 0.62 w ta R 25c (70mm70mm1.6mm single-layer board, 6.28mm 2 copper heat dissipation pad), power dissipated at 5.0mw / c. power dissipation 3 pd3 1.77 w ta R 25c ( 70mm 70mm 1.6mm 4-layer board, 6.28 mm 2 copper heat dissipation pad on top and bottom layer, 5505 mm 2 pad on 2 nd and 3 rd layer), power dissipated at 14.1mw / c. power dissipation 4 pd4 2.66 w t a R 25c ( 70mm 70mm 1.6mm 4-layer board, all layers with 5505 mm 2 copper heat dissipation pads), power dissipated at 21.3mw / c. operating temperature ra nge topr -20 to +100 * 1 storage temperature range tstg -55 to +150 junction temperature tjmax +150 *1 not to exceed pd. operating ratings (ta= -20 to 100 ) parameter symbol limit unit min typ max input voltage vin 7.5 12 15 v vreg voltage vreg 4.5 5.0 5.5 v boot voltage boot 4.5 - 21 v sw voltage sw -0.7 - 15 v boot-sw voltage boot-sw 4.5 - 5.5 v en input voltage en 0 - 15 v output voltage vout *2 0.8 - 5.5 v pgood voltage pgood 0 - 5.5 v minimum on time tonmin - - 200 nsec *2 v out depends on input voltage (v in ) in some cases. downloaded from: http:///
datasheet d a t a s h e e t 5/23 bd95831muv tsz02201-0333aac00090-1-2 18.mar.2013 rev.003 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 electrical characteristics (unless otherwise noted ta=25 , vin=12v, en=3v, vout=3.3v) parameter symbol limit unit condition min typ max vin bias current i in - 1.2 2.0 ma vin standby current i in_stb - 2 15 ? a en=0v enable control en low voltage en low gnd - 0.3 v en high voltage en high 2.2 - 15 v en bias current i en - 3 10 ? a en=3v vreg output voltage vreg standby voltage v reg_stb - - 0.1 v en=0v vreg output voltage v reg 4.5 5.0 5.5 v i reg =10ma maximum output current i reg 10 - - ma power mosfet high side fet on resistance r onh - 85 170 m low side fet on resistance r onl - 55 110 m reference voltage fb threshold voltage v fb 0.788 0.800 0.812 v fb input current i fb -1 - 1 ? a h 3 reg control on time t on - 470 - nsec minimum off time t offmin 200 450 - nsec soft start / output discharge soft start time t soft - 1.0 - msec vout discharge current i vout 3 6.6 - ma vout=1v, en=0v, v reg =5v downloaded from: http:///
datasheet d a t a s h e e t 6/23 bd95831muv tsz02201-0333aac00090-1-2 18.mar.2013 rev.003 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 electrical characteristics (continued) (unless otherwise noted ta=25 , vin=12v, en=3v, vout=3.3v) parameter symbol limit unit condition min typ max over current protection over current protection current limit i ocp 3.5 4.5 6.0 a *3 scp scp threshold voltage v scp 0.48 0.56 0.64 v v fb =0.8v 0v scp delay time t scp - 1.0 - msec ovp ovp threshold voltage v ovp 0.86 0.96 1.06 v v fb =0.8v 2.0v ovp delay time t ovp - 1.0 - msec uvlo vreg threshold voltage v reg_uvlo 3.75 4.20 4.65 v vreg: sweep up vreg hysteresis voltage dv reg_uvlo 100 160 220 mv vreg: sweep down power good v fb power good low voltage v fb_pl 0.61 0.68 0.75 v v fb =0.8v 0v v fb power good high voltage v fb_ph 0.65 0.72 0.79 v v fb =0v 0.8v 3 no tested on outgoing inspection. downloaded from: http:///
datasheet d a t a s h e e t 7/23 bd95831muv tsz02201-0333aac00090-1-2 18.mar.2013 rev.003 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 typical performance curves (unless otherwise noted ta=25 , vin=12v) 0 10 20 30 40 50 60 70 0123 iout [a] tc [ ] figure 4. efficiency (vin=12v, l=3.3 ? h) figure 5. tc C iout (vin=12v, vout=3.3v, l=3.3 ? h) figure 6. vout ripple voltage (vin=12v, vout=3.3v, l=3.3 ? h, cout=44 ? f, iout=0a) figure 7. vout ripple voltage (vin=12v, vout=3.3v, l=3.3 ? h, cout=44 ? f, iout=3a) vout (ac) 2 0mv/div sw 5v/div 1 ? sec/div vout (ac) 2 0mv/div sw 5v/div 1 ? sec/div 0 10 20 30 40 50 60 70 80 90 100 0123 iout [a] efficien cy [%] vout = 5.0v vout = 3.3v vout = 1.2v downloaded from: http:///
datasheet d a t a s h e e t 8/23 bd95831muv tsz02201-0333aac00090-1-2 18.mar.2013 rev.003 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 typical performance curves (unless otherwise noted ta=25 , vin=12v) (continued) figure 8. vout load regulation (vin=12v, vout=3.3v, l=3.3 ? h) figure 9. vout line regulation (vout=3.3v, l=3.3 ? h, iout=0a / 3a) figure 10. vout - temperature (vin=12v, vout=3.3v, l=3.3 ? h, iout=0a) figure 11. frequency - vin (vin=12v, vout=3.3v, l=3.3 ? h, iout=0a) 3.10 3.15 3.20 3.25 3.30 3.35 3.40 0123 iout [a] vout [v] 3.10 3.15 3.20 3.25 3.30 3.35 3.40 7 9 11 13 15 vin [v] vout [v] iout=0a iout=3a 500 550 600 650 700 750 800 7 9 11 13 15 vin [v] frequency [khz] 3.20 3.25 3.30 3.35 3.40 -20 0 20 40 60 80 100 temperature [ ] vout [v] downloaded from: http:///
datasheet d a t a s h e e t 9/23 bd95831muv tsz02201-0333aac00090-1-2 18.mar.2013 rev.003 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 typical performance curves (unless otherwise noted ta=25 , vin=12v) (continued) figure 12. start up with en (vin=12v, vout=3.3v, l=3.3 ? h, cout=44 ? f, iout=0a) figure 13. power down with en (vin=12v, vout=3.3v, l=3.3 ? h, cout=44 ? f, iout=0a) figure 14. vout transient response (vin=12v, vout=3.3v, l=3.3 ? h, cout=44 ? f) iout=0 ? 2a (sr=1.0a/ ? sec) figure 15. ocp function (vin=12v, vout=3.3v, l=3.3 ? h, cout=44 ? f) (vout is shorted to ground) en 5v/div pgood 5v/div sw 10v/div vout 2v/div 200 ? sec/div en 5v/div pgood 5v/div sw 10v/div vout 2v/div 10msec/div vout (ac) 50mv/div iout 2a/div 100 ? sec/div vout 2v/div sw 20v/div il 2a/div 200 ? sec/div downloaded from: http:///
datasheet d a t a s h e e t 10/23 bd95831muv tsz02201-0333aac00090-1-2 18.mar.2013 rev.003 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 explanation of operation the bd95831muv is a 1ch synchronous buck conv erter incorporating rohms proprietary h 3 reg tm controlla system. when vout drops due to a rapid load change, the system quickly restores vout by increasing the frequency. 1. h 3 reg tm system 1-1. normal operation when fb falls below the threshold voltage (ref), a drop is detected, activating the h 3 reg tm controlla system. f 1 v v ton in out ? ? [sec] (1) hg (gate of high side mosfet) output is determined by the formula (1). lg (gate of low side mosfet) output operates until fb voltage falls below ref voltage after hg becomes off. off time is restricted by min off time (typ.:450nsec). hence, bd95831muv runs with a constant on-time by using the input and output voltage to set the internal on-time timer. 1-2. vout drops due to a rapid load change when fb (vout) drops due to a rapid load change and the voltage remains below ref, the system quickly restores vout by shortening off time of hg (increasing the frequency), improving transient response as shown figure 16 (b). fb ref hg io lg fb ref hglg figure 16. h 3 reg system (a) normal operation (b) rapid load change downloaded from: http:///
datasheet d a t a s h e e t 11/23 bd95831muv tsz02201-0333aac00090-1-2 18.mar.2013 rev.003 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 timing chart 1. soft start function soft start is utilized when the en pin is set high. current cont rol takes effect at startup, enabling a moderate ramping start on the output voltage. soft start time is 1.0msec (typ). rush current is determined via formula (2) below. 1.0msec v c i out out in ? ? [a] (2) c out : all capacitors connected with v out 2. power good function when fb voltage is more than 0.72v (90%), the integrated open-drain nmos is set to off, and pgood outputs high due to pull-up register. if fb voltage falls below 0.68v (85%), pgood becomes low. en fb i in 1.0msec (typ) vout en fb pgood 0.72v 0.68v figure 17. soft start timing chart figure 18. power good timing chart downloaded from: http:///
datasheet d a t a s h e e t 12/23 bd95831muv tsz02201-0333aac00090-1-2 18.mar.2013 rev.003 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 protection operation 1. ocp operation normally, when fb voltage falls below ref voltage, hg becomes high. however, if the current through the inductor (i l ) exceeds ocp current value (i ocp ) during lg=on, hg does not become high and i l is restricted by i ocp . when i l falls down below i ocp , hg is stricken by the pulse width of ton decided by formula (1). as the result, the output voltage can decrease as the frequency and duty are changed. when ocp is released in the state that the output has decreased by ocp operation, the output voltage might rise up due to high-speed load response. also off latch is operated when fb voltage becomes below the scp setting voltage during 1msec (typ.) (refer to 2-1). 2. scp operation / ovp operation (off latch) 2-1. scp operation scp monitors fb voltage. when fb falls below 0.56v, after 1mse c (typ.) later, the short circuit protection (scp) operates, turning the high side mosfet and low side mosfet off, and performs off latch operation. 2-2. ovp operation ovp monitors fb voltage. when fb exceeds 0.96v, after 1msec (typ.) later, the output over voltage protection (ovp) operates, turning the high side fet off and the low side fet on, and performs off latch operation. 2-3. recovery from off latch mode off latch is released by en=off or uvlo operation, and then it returns to standard operation. figure 19. ocp timing chart downloaded from: http:///
datasheet d a t a s h e e t 13/23 bd95831muv tsz02201-0333aac00090-1-2 18.mar.2013 rev.003 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 3. tsd operation (self recovery) tsd is self-activating. if the junction temperature exceeds tj = 175 , and hg, lg, pgood, and ss become low. the ic becomes standby when tsd operating. when tj falls below 150 , it returns to standard operation . 4. uvlo operation uvlo operates when v reg voltage falls below 4.05v, ad hg, lg, pgood and ss become low. the ic becomes standby when uvlo operating. uvlo is released when v reg goes up to 4.2v, and starts standard operation figure 20. scp timing chart figure 21. ovp timing chart hg lg fb 0.96v lg=h fb > ref, hg=l ss l y y vreg en l y l downloaded from: http:///
datasheet d a t a s h e e t 14/23 bd95831muv tsz02201-0333aac00090-1-2 18.mar.2013 rev.003 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 selection of components externally connected 1. output lc filter selection (buck converter) 1-1. inductor (l) selection the output lc filter is required to supply constant current to the output load. a larger value inductance at this filter result s in less inductor ripple current ( ? i l ) and less output ripple voltage. however, the larger value inductors tend to have less fast load transient-response, a larger physical size, a lower saturation current and higher series resistance. a smaller value inductance has almost opposite characteristics above. the recommended inductor values are shown in table 1(refer to page 18). the value of i l is shown as formula (3). ?? in out out in l v f l v v v i ? ? ? ? ? [a] (3) for example, with v in = 12 v, v out = 3.3 v, l = 3.3 ? h and the switching frequency f = 600 khz, the calculated ripple current S i l is 1.2a. then, the inductor saturation current must be larger than the sum of the maximum output current (i outmax) and 1/2 of the inductor ripple current ( ? i l / 2). a larger current than the inductors saturation current will cause magnetic saturation in the inductor, and decrease efficiency. when selecting an inductor, be sure to allow enough margins to assure that peak current does not exceed the inductors saturation current value. to minimize loss of inductor and improve efficiency, choose a inductor with a low resistance (dcr, acr). 1-2. output capacitor (c out ) selection output capacitor (c out ) has a considerable influence on output voltage regulation due to a rapid load change and smoothing output ripple voltage. determine the capacitor by considering the value of capacity, the equivalent series resistance, and equivalent series inductance. also, make sure the capacitors voltage rating is high enough for the set output voltage (including ripple). output ripple voltage is determined as in formula (4) below. vout= i l /(8 c out f)+esr i l +esl i l / ton [v] (4) ( i l output ripple current esr: equivalent series resistance esl: equivalent series inductance) also, give consideration to the conditions in formula (5) below for output capacitance, bearing in mind that output rise time must be established within the fixed soft start time. as output capacitance, bypass capacitor will be also connecte d to output load side (c ext , figure 23). please set the over current detection value with regards to these capacitance. ? ? out out ocp out v i i 1msec c ? ? ? [f] (5) ( i ocp : ocp current limit, i out : output current) note: an improper output capacitor may cause startup malfunctions. v in i l l c out vout hg sw lg figure 22. inductor ripple current i t inductor saturation current > i outmax + S i l /2 average inductor current (output current iout) S i l downloaded from: http:///
datasheet d a t a s h e e t 15/23 bd95831muv tsz02201-0333aac00090-1-2 18.mar.2013 rev.003 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 2. input capacitor (cin) selection 3. output voltage setting the ic controls output voltage as ref P v fb . however, the actual output voltage will also reflect the average ripple voltage value. the output voltage is set with a resistor divider from the output node to the fb pin. the formula for output voltage is given in (7) below: output voltage = ref + vout [v] (7) ref = v fb (typ 0.8v) + 0.02 C (on duty 0.05) [v] (8) on duty = (9) please refer to eq. (4) regarding vout. figure 24. input capacitor in order to prevent transient spikes in voltage, the input capacitor should have a lo w enough esr resistance to fully support a large ripple current. the formula for ripple current i rms is given in equation (6) as below. where v in =2 vout, i rms = i out 2 v in l c out vout c in hg sw lg a lo w esr capacitor is recommended to reduce esr loss and improve efficiency. r1+r2 r2 h 3 reg tm controlla s rq driver circuit output voltage vout v fb r1 r2 ref v in ( 6 ) in out in out out rms v ) v (v v i i ? ? ? ? vout v in figure 23. output capacitor [a] figure 25. output voltage setting vin l c out vout esr esl hg sw lg load c ext downloaded from: http:///
datasheet d a t a s h e e t 16/23 bd95831muv tsz02201-0333aac00090-1-2 18.mar.2013 rev.003 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 4. relationship between output voltage and ontime bd95831muv is a synchronous buck converter controlling constant ontime. the ontime (ton) depends on the output voltage settings, as described by the formula (10). 55 v 610 v v 1770 ton in in out ? ? ? ? [nsec] (10) the frequency of the application condition is determined by the formula (11) using the above ton. frequency = [khz] (11) however with actual applications, there exists a rising and falling time of the sw due to the gate capacitance of the integrated mosfet and the switching speed, which may vary the above parameters. therefore please also verify those parameters experimentally. 5. relationship between output current and frequency bd95831muv is a constant ontime type of switching regulator. when the output current increases, the switching loss of the inductor, mosfet, and output capacitor also increases. hence the switching frequency speeds up. the loss of the inductor, mosfet, and output capacitor is determined as below. (dcr : inductor equivalent series resistance r onh : on resistance of high-side mosfet r onl : on resistance of low-side mosfet esr :cout equivalent series resistance) taking the above losses into the frequency equation, then t (=1/freq) becomes [nsec] (12) however since the parasitic resistance of the pcb layout pattern exists in actual applications and affects the p arameter, please also verify experimentally. vout v in 1 ton loss of inductor = iout 2 dcr vin vout loss of mosfet (high side) = iout 2 r onh vin loss of mosfet (low side) = iout 2 r onl (1 - vout ) loss of output capacitor = iout 2 esr vin iout ton vout iout + + + + t (=1/freq) = downloaded from: http:///
datasheet d a t a s h e e t 17/23 bd95831muv tsz02201-0333aac00090-1-2 18.mar.2013 rev.003 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 pcb layout guide two high pulsing current flowing loops exist in the buck regulator system. the first loop, when fet is on, starts from the input capacitors, to the vin terminal, to the sw terminal, to the inductor, to the output capacitors, and then returns to the input capacitor through gnd. the second loop, when fet is off, starts from the low fet, to the inductor, to the output capacitor, and then ret urns to the low fet through gnd. to reduce the noise and improve the efficiency, please minimize these two loop area. especially input capacitor and output capacitor should be connected to gnd (pgnd) plain. pcb layout may affect the thermal performance, noise and efficiency greatly. so please take extra care when designing pcb layout patterns. ? the thermal pad on the back side of ic has the great thermal conduction to the chip. so using the gnd plain as broad and wide as possible can help thermal dissipation. and a lot of thermal via for helping the spread of heat to the different layer i s also effective. ? the input capacitors should be connected to pgnd as close as possible to the vin terminal. ? the inductor and the output capacitors should be placed close to sw pin as much as possible. c in fet c out l vout vin figure 26. current loop buck regulator system downloaded from: http:///
datasheet d a t a s h e e t 18/23 bd95831muv tsz02201-0333aac00090-1-2 18.mar.2013 rev.003 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 list of evaluation board components table 1. recommended bom list(vin=12v) symbol part value manufacture series l1 coil toko fdvc0630 series tdk spm6530 series cin (c1, c2) ceramic capacitor 10 ? f / 25v murata grm31cr71e16ka12 cout (c3, c4) ceramic capacitor 22 ? f / 16v murata grm31cb31c226me15 boot_c (c5) ceramic capacitor 0.01 ? f / 50v murata grm18 series r1 resistance 100k rohm mcr03 series r2 resistance rohm mcr03 series r3 resistance rohm mcr03 series r4 resistance rohm mcr03 series vreg_c (c6) ceramic capacitor 0.022 ? f / 50v murata grm18 series the above components list is an example. please check actual circuit characteristics on the application carefully before use. vout r2 r3 r4 l1 1.0v 360 130 2.2k 1.5 ? h 1.2v 2k 220 4.7k 1.5 ? h 1.8v 5.6k 110 4.7k 2.2 ? h 3.3v 13k 1.5k 4.7k 3.3 ? h 5.0v 24k 680 4.7k 3.3 ? h figure 27. typical application circuit (vout=3.3v) l . _ . . _ . . . downloaded from: http:///
datasheet d a t a s h e e t 19/23 bd95831muv tsz02201-0333aac00090-1-2 18.mar.2013 rev.003 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 i/o equivalence circuit vin sw boot en pgood vout fb vreg boot vreg sw 167k 833k en pgood fb vout vin boot vreg sw boot vin vin sw vreg downloaded from: http:///
datasheet d a t a s h e e t 20/23 bd95831muv tsz02201-0333aac00090-1-2 18.mar.2013 rev.003 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 operational notes (1) absolute maximum ratings use of the ic in excess of absolute maximum ratings may result in damage to the ic. assumptions should not be made regarding the state of the ic (e.g., short mode or open mode) when such damage is suffered. if operational values are expected to exceed the maximum ratings for the device, consider adding protective circuitry (such as fuses) to eliminate the risk of damaging the ic. (2) gnd voltage the potential of the gnd, pgnd pin must be the minimum potential in the system in all operating conditions. (3) thermal design use a thermal design that allows for a sufficient margin for power dissipation (pd) under actual operating conditions (4) inter-pin shorts and mounting errors use caution when orienting and positioning the ic for moun ting on printed circuit boards. improper mounting may result in damage to the ic. shorts between output pins or between output pins and the power supply and gnd pins caused by poor soldering or foreign objects may result in damage to the ic. (5) operation in strong electromagnetic fields using this product in strong electromagnetic fields may cause ic malfunction. caution should be exercised in applications where strong electromagnetic fields may be present. (6) aso (area of safe operation) when using the ic, ensure that operating conditions do not exceed absolute maximum ratings or aso of the output transistors. (7) testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from a jig or fixture during the evaluation process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. (8) electrical characteristics the electrical characteristics indicated in this datasheet ma y change upon the conditions of temperature, supply voltage, and external components. please validate/verify your design at the worst case conditions. (9) not of a radiation-resistant design. (10) back electromotive force if a large inductive load is connected at the output pin that might cause introducing back electromotive force at the start up and at the output disable, please insert protection diodes. (11) regarding input pins of the ic this monolithic ic contains p+ isolation and p substrate layers between adjacent elements in order to keep them isolated. pn junctions are formed at the intersection of these p layers with the n layers of other elements, creating parasitic diodes and/or transistors. for example (refer to the figure below): ? ? when gnd > pin a and gnd > pin b, the pn junction operates as a parasitic diode ? when gnd > pin b, the pn junction operates as a parasitic transistor parasitic diodes occur inevitably in the structure of the ic, and the operation of these parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. accordingly, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. output pin figure 28. back electromotive force downloaded from: http:///
datasheet d a t a s h e e t 21/23 bd95831muv tsz02201-0333aac00090-1-2 18.mar.2013 rev.003 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 (12) ground wiring pattern when using both small-signal and large-current gnd traces , the two ground traces should be routed separately but connected to a single ground potential within the applicati on in order to avoid variations in the small-signal ground caused by large currents. also ensure that the gnd trac es of external components do not cause variations on gnd voltage. (13) operating condition the electrical characteristics indicated in this datasheet are not guaranteed for the whole operational and temperature ranges, however these characteristics do not significantly fluctuate within the operational and temperature ranges. (14) thermal shutdown (tsd) circuit the ic incorporates a built-in thermal shutdown circuit, which is designed to turn the ic off completely in the event of thermal overload. it is not designed to protect the ic from damage or guarantee its operation. ics should not be used after this function has activated, or in applications wher e the operation of this circuit is assumed. if the thermal shutdown is activated while the load current exists, the output may possibly be latched off at the release of the thermal shutdown. (15) heat sink (fin) the heat sink (fin) is connected to the substrate. please connect it to gnd. tsd on temp.[ ] (typ.) hysteresis temp[ ] (typ.) 175 25 figure 29. example of ic structure resistor transistor (npn) n n n p + p + p p substrate gnd parasitic element pin a n n p + p + p p substrate gnd parasitic element pin b c b e n gnd pin a parasitic element pin b other adjacent elements e b c gnd parasitic element downloaded from: http:///
datasheet d a t a s h e e t 22/23 bd95831muv tsz02201-0333aac00090-1-2 18.mar.2013 rev.003 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 thermal derating curves ordering information b d 9 5 8 3 1 m u v - e 2 part numbe r package muv: vqfn016v3030 packaging and forming specification e2: embossed tape and reel physical dimension tape and reel information marking diagram vqfn016v3030 (top view) 831 part number marking lot number 1pin mark d95 figure 30. thermal derating curve (vqfn016v3030) ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs e2 () direction of feed reel 1pin (unit : mm) vqfn016v3030 1 12 9 1613 4 8 5 0.5 0.75 0.25 +0.05 0.04 1.4 0.1 1.4 0.1 0.4 0.1 c0.2 1.0max 0.02 +0.03 0.02 (0.22) 3.0 0.1 3.0 0.1 1pin mark 0.08 s s (1) 4 layer board (all layers with 5505 mm 2 copper heat dissipation pads) j-a=47.0 /w (2) 4 layer board (6.28 mm 2 copper heat dissipation pad on top and bottom layer, 5505 mm 2 pad on 2 nd and 3 rd layer) j-a=70.62 /w (3) 1 layer board (6.28 mm 2 copper heat dissipation pad) j-a=201.6 /w downloaded from: http:///
datasheet d a t a s h e e t 23/23 bd95831muv tsz02201-0333aac00090-1-2 18.mar.2013 rev.003 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 revision history date revision changes 6.aug.2012 001 new release 24.aug.2012 002 revised the general description 18.mar.2013 003 revised the general description downloaded from: http:///
notice- ge rev.003 ? 2013 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufactured for application in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremely h igh reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecraft, nuclear powe r controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ( specific applications ), please consult with the rohm sales representative in adv ance. unless otherwise agreed in writing by rohm in advance, rohm s hall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arisin g from the use of any rohm s products for specific applications. (note1) medical equipment classification of the specific app lications japan usa eu china class class class b class class | class 2. rohm designs and manufactures its products subject to s trict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adeq uate safety measures including but not limited to fail-safe desig n against the physical injury, damage to any property, whic h a failure or malfunction of our products may cause. the followi ng are examples of safety measures: [a] installation of protection circuits or other protective devic es to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified be low. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arisi ng from the use of any rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified belo w), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be n ecessary: [a] use of our products in any types of liquid, including water, oils, chemicals, and organi c solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products are e xposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed t o static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing component s, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subject to radiation-proof design. 5. please verify and confirm characteristics of the final or mou nted products in using the products. 6. in particular, if a transient load (a large amount of load a pplied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mou nting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating u nder steady-state loading condition may negatively affec t product performance and reliability. 7. de -rate power dissipation (pd) depending on ambient temperature (ta). wh en used in sealed area, confirm the actual ambient temperature. 8. confirm that operation temperature is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, e tc.) flux is used, the residue of flux may negatively affect p roduct performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method mu st be used on a through hole mount products. i f the flow soldering method is preferred on a surface-mount p roducts , please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
notice- ge rev.003 ? 2013 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the products and external components, inc luding transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and associated data and information contained in this docu ment are presented only as guidance for products use. therefore, i n case you use such information, you are solel y responsible for it and you must exercise your own independ ent verification and judgment in the use of such information contained in this document. rohm shall not be in any way respon sible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such informat ion. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take pr oper caution in your manufacturing process and storage so t hat voltage exceeding the products maximum rating will not be applied to products. please take special care under dry co ndition (e.g. grounding of human body / equipment / solder iro n, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate if the products are stored in the places where: [a] the products are exposed to sea winds or corrosive gases, in cluding cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderab ility of products out of recommended storage time period may be degraded. it is strongly recommended to confirm so lderability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is in dicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a c arton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage tim e period. precaution for product label qr code printed on rohm products label is for rohm s internal use only. precaution for disposition when disposing products please dispose them properly usi ng an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under controlled goods prescr ibed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to ap plication example contained in this document is for referen ce only. rohm does not warrant that foregoing information or da ta will not infringe any intellectual property rights or any other rights of a ny third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or other d amages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any i ntellectual property rights or other rights of rohm or any third parties with respect to the information contained in this d ocument. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any way whatsoever the products and the related technical information contained in the products or this document for any military purposes, includi ng but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described i n this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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